Testing

Test Software and Hardware Development & Engineering Support

RF, Logic, Linear, Mixed Signal, Analog, Digital, Memory - Supporting ALL package styles
Electrical Characterization Testing (Hot and Cold Temp)
Test Software Conversions
Hardware Development and Equipment Selection
Package Test & Wafer Probe

Ambient, Hot & Cold Temperature Testing
Commercial, Military, Space, Automotive & Telecom Device Testing
Custom Test Processing - Commercial to Military Temps / Flow
COTS Upscreening (-55°C to 125°C)
Reliability Stress Testing

HTOL, LTOL, HAST, T/C, THB testing, IR Pre-Conditioning, Latch-Up & ESD testing
Automated ESD Sensitivity Classification & Latch-Up Testing (1024 Pin):
Human Body Model (HBM) per JEDEC, ESDA, Mil-Std-883, AEC and Lucent standards
Machine Model (MM) per JEDEC, ESDA and AEC standards
Charged Device Model (CDM) per JEDEC, ESDA, AEC and Lucent standards

Characterize all pins, establish ESD sensitivities and failure threshold
Military Classifications: Per MIL-STD 883, Method 3015
PEM Quals for OEMs (Military, Space, Telecom, Auto)
Characterization / Analysis: Graphically monitor leakage changes
Latch-up per JEDEC 17 & 78; custom; elevated temperature to 150°C
Full Service Processing

Tape & Reel, Lead Scanning, Bake & Dry Pack, Drop Ship
Extensive High Speed Digital & Mixed Signal Engineering Expertise

Development Experience with Complex Devices:
Microprocessors / DSP / Microcontroller / Graphic Engines
Communications (Ethernet, DSL, Base Band, Networking)
Consumer (Games, Digital Audio, Digital TV, Set Top Box)
System-On-a-Chip (SOC) / High Performance ASIC and ASSP

Digital Test Development Capabilities:
Simulation to Test Vector Conversion
>600 pins @ >600Mhz, ± 125ps
Algorithmic Memory Test
Pattern Depth 28Meg & SCAN (>128M)
Emphasis on Multi-site

Established Reputation for RF IC testing
World-Wide Production Processing & Support
Test Platform Conversions