Tape & Reel

Axial
Right Parts offers a complete range of services for axial components, including: trimming, straightening, testing, sorting, marking, tape & reel (Class I, II, III, and 26mm formats), sequencing, washing and retaping.

All axial tape & reel services adhere to EIA-296-F, as well as customer-supplied specifications.

Radial
With over 15 years of experience, Right Parts radial component packaging services are the most comprehensive in the industry. We offer a complete range of services for radial components, including: straightening, custom lead forming, orienting, sorting, washing and tape & reel packaging.

Right Parts also offers quick-turn services for; TO220, TO92, TO98 Transistors, Euro-Form, Hairpin, LEDs, SIPs, Large Electrolytics, Odd-Forms and other auto-insertable Radial Devices.

All radial tape & reel services adhere to EIA-468-B, as well as customer-supplied specifications.

Euro-Form
Right Parts exclusive "Euro-Forming" service is designed streamline your assembly processes and add profit to your bottom line. By converting your axial devices to radial format, you may be able to reduce if not eliminate your axial insertion operations. Right Parts will repackage your axial resistors, diodes and capacitors to a “Hairpin” format for insertion as radial devices. Provide your components in bulk or taped & reeled format and Right Parts will straighten, lead form and repackage them in ammopak or tape & reel formats.

All Radial tape & reel services adhere to EIA-468B, as well as customer-supplied specifications.

Surface Mount
Right Parts state-of-the-art SMD packaging facilities are among the most advanced in the industry. We are capable of processing all common SMD's (ranging from 8mm-200mm) as well as Wafer Level Chip Scale Devices. We maintain a large inventory of carrier tapes and offer custom carrier tape design and manufacture as well as wafer dicing services.

All SMD Tape & Reel processes comply with EIA-481-C.

Odd-Form
Streamline your assembly processes and let Right Parts provide a Tape & Reel Solution for your Non-Standard or Odd-Form Devices. Your assembled costs will be reduced. Guaranteed!

Stampings, molded parts, labels and other non-standard EIA or JEDEC parts can be automatically assembled with the same reliability, speed and often the same type of equipment used to assemble QFPs, SOICs, PLCCs and other surface mount devices. Advancements in Tape & Reel Packaging offer the same opportunities for Odd-Form devices as it has for Axial, Radial, LED and Surface Mounted Devices.

* Tape & Reel Component Packaging, features and benefits:
* Simplifies material handling
* Superior part protection
* Bar code identification for dynamic inventory control and product tractability
* ESD protection
* Reliable and precise part feeding
* Compatible with automated assembly equipment and processes
* Cost effective

Wafer Level CSPs
Right Parts extends the benefits of tape & reel packaging to wafer level chip scale packages and flip chip devices. LFBGAs, Micro BGAs, MEMS and other Microelectronic Devices can now be taped & reeled to simplify handling and support high speed assembly processes.

Right Parts wafer level packaging services feature:

* High Resolution Wafer Defect Inspection
* 2D/3D Bump Inspection
* Back Side Inspection
* Die Sorting
* Automatic Reject Part Removal
* Wafer Processing Capability up to 200mm
* Chip Inverting
* Heat seal and pressure sensitive adhesive cover tapes
* Moisture Bake-out/Dry-Packing
* Bar Code Labeling
* Expedited Services
* 0.5mm to 24mm Die Handling Capacity
* Custom carrier design and manufacture - 8mm to 32mm
* Processing capability for diced or undiced wafers